UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global

The most common physical package for UFS 3.1 is the , measuring approximately 11.5mm x 13.0mm. The reduced pin count compared to eMMC simplifies PCB routing while enabling much higher bandwidth.

Ground pins used for power return and signal shielding. Clock and Control Signals

Power supply for the controller and I/O interface, typically 1.14V to 1.26V (nominal 1.2V).

Ufs 3.1 Pinout ^hot^ -

UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global

The most common physical package for UFS 3.1 is the , measuring approximately 11.5mm x 13.0mm. The reduced pin count compared to eMMC simplifies PCB routing while enabling much higher bandwidth. ufs 3.1 pinout

Ground pins used for power return and signal shielding. Clock and Control Signals typically 1.14V to 1.26V (nominal 1.2V).

Power supply for the controller and I/O interface, typically 1.14V to 1.26V (nominal 1.2V). ufs 3.1 pinout